Photo Gallery

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Scanning electron microscope (SEM) view of an electrical overstress damage (EOS) at one input circuit of an integrated circuit (IC) chip. The failure cause was an overvoltage condition at this input pin.

Scanning electron microscope (SEM) image of tungsten filament of a lamp (that had experienced an early failure) revealing ununiform grain structure.

Thermographic image of an overheated high voltage connection terminal in a building's main electrical panel. The failure cause was intermittent/loose connection.

 
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Scanning electron microscope (SEM) image of a cross-sectioned SMT capacitor revealing cracks in the internal ceramic dielectric layers. The failure cause was excessive bending of the circuit board during SMT mounting process assembly.

Scanning electron microscope (SEM) image of an open contact failure between the wire bond and its mounting pad. The failure was caused by an intermetallic layer forming between the wire bond and its pad (wire bond process failure).

An optical microscope view of an AMD microprocessor during internal visual examination, part of device qualification test.

 
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Thermographic inspection of hot/cold water piping network in a building revealing no signs of leakage or blockage.

Thermographic image of an overheated elevator electric motor in a building due to poor maintenance service.

This keyboard’s gold contact pad was corroded as a result of insufficient plating thickness and poor cleaning process.