Scanning electron microscope (SEM) image of a cross-sectioned SMT capacitor revealing cracks in the internal ceramic dielectric layers. The failure cause was excessive bending of the circuit board during SMT mounting process assembly.
Scanning electron microscope (SEM) image of an open contact failure between the wire bond and its mounting pad. The failure was caused by an intermetallic layer forming between the wire bond and its pad (wire bond process failure).
An optical microscope view of an AMD microprocessor during internal visual examination, part of device qualification test.